Green Silicon Carbide Abrasive (GC)
1. High purity and hardness Green silicon carbide generally contains over 99% SiC, higher than black silicon carbide at 97%-98.5%. Its Mohs hardness of 9.2-9.4 exceeds alumina and is below diamond, cubic boron nitride and boron carbide. 2. Sharp, friable grains with good self-sha...
Read the full description- Color
- Green and translucent
- Grit size — Microgrit
- 240# - 12500#
- Grit size — F grit (bonded abrasives)
- F14 - F220
- Grit size — P grit (coated abrasives)
- P series
Bodan supplies this item to specification. Share the material, machine and required finish and we will confirm the grade, dimensions and packing for your order.
Advantages
Key features
-
High purity and hardness
Green silicon carbide generally contains over 99% SiC, higher than black silicon carbide at 97%-98.5%. Its Mohs hardness of 9.2-9.4 exceeds alumina and is below diamond, cubic boron nitride and boron carbide.
-
Sharp, friable grains with good self-sharpening
Green silicon carbide is slightly more friable than black silicon carbide, allowing grains to fracture continuously and expose fresh cutting edges for precision grinding and polishing.
-
Good thermal conductivity and semiconductor properties
Good thermal conductivity and semiconductor properties suit high-temperature heating elements and electronic-grade applications.
-
Excellent chemical stability
Stable chemistry supports grinding under demanding operating conditions.
Technical data
Specifications
- Color
- Green and translucent
- Grit size — Microgrit
- 240# - 12500#
- Grit size — F grit (bonded abrasives)
- F14 - F220
- Grit size — P grit (coated abrasives)
- P series
- Melting point
- Approximately 2600℃
- Microhardness
- 840 - 3320 kg/mm²
- Mohs hardness
- 9.2-9.4 Mohs
- Chemical formula
- SiC
- Particle density
- 3.20 - 3.25 g/cm³
- Smelting process
- High-temperature resistance-furnace smelting (>2200℃)
- Loose bulk density
- 1.20 - 1.60 g/cm³
Product details
About this product
Product Overview
Green silicon carbide, designated GC, is a synthetic abrasive made from petroleum coke and quality quartz sand, with salt as an additive, in a resistance furnace above 2200℃. Its green, translucent hexagonal crystals have higher purity than black silicon carbide and are sharp and friable. A complete range from F grit to micropowder supports precision grinding, semiconductor processing and high-performance ceramic manufacturing.
Product Parameters
| Specifications | Details |
|---|---|
| Product name | Green Silicon Carbide Abrasive (GC) |
| Chemical formula | SiC |
| Smelting process | High-temperature resistance-furnace smelting (>2200℃) |
| Appearance / color | Green and translucent |
| Mohs hardness | 9.2-9.4 Mohs |
| Particle density | 3.20 - 3.25 g/cm³ |
| Bulk density | 1.20 - 1.60 g/cm³ |
| Melting point | Approximately 2600℃ |
| Microhardness | 840 - 3320 kg/mm² |
Core Performance Advantages
1. High purity and hardness
Green silicon carbide generally contains over 99% SiC, higher than black silicon carbide at 97%-98.5%. Its Mohs hardness of 9.2-9.4 exceeds alumina and is below diamond, cubic boron nitride and boron carbide.
2. Sharp, friable grains with good self-sharpening
Green silicon carbide is slightly more friable than black silicon carbide, allowing grains to fracture continuously and expose fresh cutting edges for precision grinding and polishing.
3. Good thermal conductivity and semiconductor properties
Good thermal conductivity and semiconductor properties suit high-temperature heating elements and electronic-grade applications.
4. Excellent chemical stability
Stable chemistry supports grinding under demanding operating conditions.
Applicable Materials
Cemented carbide and titanium alloys
Optical glass, ceramics, stone and other non-metals
Semiconductors: monocrystalline and polycrystalline silicon wafers
Gemstones, agate and other premium jewelry materials
Hardened steel and high-speed steel tools
Main Applications
Application areas and specific uses
Semiconductors and electronics: cutting abrasives and lapping-fluid components for precise thinning and mirror polishing of monocrystalline and polycrystalline silicon wafers
Precision grinding: fine grinding and polishing of carbide tools, optical glass, ceramic bearings, gemstones and other hard, brittle materials
Bonded abrasives: vitrified wheels, resin wheels, honing stones and mounted points
Photovoltaics: wire sawing silicon ingots to reduce material loss
Refractories: silicon carbide bricks, castables and high-temperature ceramics
Coated abrasives: abrasive paper and cloth
Product Specifications
| Grit type | Range | Typical applications |
|---|---|---|
| F grit (bonded abrasives) | F14 - F220 | Manufacturing bonded abrasives such as wheels and mounted points |
| P grit (coated abrasives) | P series | Coated abrasives such as paper and cloth |
| Micropowder | 240# - 12500# | Precision grinding, polishing and semiconductor cutting |
Chemical Composition Standard (Micropowder Grade)
| Grit range | SiC (%) | F.C (%) | Fe2O3 (%) |
|---|---|---|---|
| 240#-3000# (4μm-60μm) | ≥ 99.2 | ≤ 0.3 | ≤ 0.15 |
| 240#-3000# (4μm-60μm) | ≥ 99.0 | ≤ 0.8 | ≤ 0.15 |
| 8000#-12500# (0.5μm-1.5μm) | ≥ 97.5 | ≤ 2.0 | ≤ 0.30 |
Packaging
Common packaging options include:
Standard: 25 kg woven bags with liners
Bulk packaging: 1 ton plastic woven bags
Pallet packaging: 25 kg bags on pallets, secured with stretch film
Custom: special packaging on request
Storage Recommendations
Store in a cool, dry, ventilated place away from moisture.
Do not store together with corrosive substances such as acids and alkalis.
Keep stacking height appropriate to prevent packaging damage.
For long-term storage, use sealed packaging to keep out dust and moisture.
Resources
Documents
Data sheets, test reports and packing details for this product are issued on request. Send an inquiry and our technical team will return the documents that match your application.
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