Resin Bonded Silicon Carbide Segment C/GC54H7BYX
Custom-Manufactured Edge Grinding Segment for Stone, Ceramic & Concrete Model: C/GC54H7BYX Dimensions: 100 × 64/57 × 25 mm (outer diameter × inner step diameter × thickness)
查看完整介绍- 结合剂
- resin-bonded
- 颜色
- Black
- 材质
- C/GC
- 粒度 — FEPA
- F
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产品优势
主要特点
Key Features
-
Hybrid C/GC Abrasive Blend
Black and green silicon carbide grains are combined to deliver both fast stock removal and consistent edge finish. The blend adapts well to mixed production runs involving granite, engineered stone, porcelain tile, and concrete.
-
Resinoid Bond for Vibration Damping
The resin bond absorbs the impact and vibration typical of high-speed edge grinding lines, reducing chipping risk on brittle ceramic edges and extending segment life under continuous operation.
-
Self-Sharpening H Hardness
Medium-soft hardness promotes controlled grain release as cutting edges dull, exposing fresh abrasive and maintaining steady cut rates. This reduces burn risk on heat-sensitive ceramic surfaces.
-
Open Structure (Grade 7)
The open structure design provides efficient chip and slurry clearance, minimizing loading and glazing during wet or dry grinding. This is particularly important when processing concrete and stone, where fines can quickly pack the wheel face.
-
Trapezoidal Profile
The trapezoidal cross-section is purpose-built for edge grinding and chamfering geometry, ensuring consistent contact angle and even wear across the segment face.
技术参数
规格参数
- 结合剂
- resin-bonded
- 颜色
- Black
- 材质
- C/GC
- 粒度 — FEPA
- F
- 粒度 — F 粒度（固结磨具）
- 54
- 目数
- 54
- 厚度 — 公制
- 22mm
- 外径 — 公制
- 100mm
相关名称
常用名称
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产品详情
产品介绍
Product Overview
This resin-bonded silicon carbide segment is engineered for edge grinding and chamfering operations on stone, ceramic tile, and concrete processing lines. The trapezoidal profile is specifically designed to match edge-grinding head geometry, ensuring precise contact and uniform material removal along tile and slab edges.
The abrasive blend combines black silicon carbide (C) and green silicon carbide (GC) grains in a high-strength resinoid bond. This hybrid formulation balances aggressive stock removal with controlled surface finish—black SiC contributes toughness and cutting efficiency on hard, brittle materials, while green SiC promotes cooler cutting and finer finish consistency. The medium-soft H hardness grade encourages self-sharpening behavior, maintaining free cutting throughout the tool life without requiring frequent dressing.
Model: C/GC54H7BYX
Dimensions: 100 × 64/57 × 25 mm (outer diameter × inner step diameter × thickness)
Key Features
Hybrid C/GC Abrasive Blend
Black and green silicon carbide grains are combined to deliver both fast stock removal and consistent edge finish. The blend adapts well to mixed production runs involving granite, engineered stone, porcelain tile, and concrete.
Resinoid Bond for Vibration Damping
The resin bond absorbs the impact and vibration typical of high-speed edge grinding lines, reducing chipping risk on brittle ceramic edges and extending segment life under continuous operation.
Self-Sharpening H Hardness
Medium-soft hardness promotes controlled grain release as cutting edges dull, exposing fresh abrasive and maintaining steady cut rates. This reduces burn risk on heat-sensitive ceramic surfaces.
Open Structure (Grade 7)
The open structure design provides efficient chip and slurry clearance, minimizing loading and glazing during wet or dry grinding. This is particularly important when processing concrete and stone, where fines can quickly pack the wheel face.
Trapezoidal Profile
The trapezoidal cross-section is purpose-built for edge grinding and chamfering geometry, ensuring consistent contact angle and even wear across the segment face.
Technical Specifications
Parameter | Specification |
Model Code | C/GC 54 H 7 B YX |
Bond Type | Resinoid (B) |
Abrasive Material | Black Silicon Carbide (C) / Green Silicon Carbide (GC) blend |
Grit Size | F54 (medium-coarse) |
Hardness | H (medium-soft, self-sharpening) |
Structure | 7 (open, chip-clearance optimized) |
Dimensions | 100 × 64/57 × 25 mm |
Profile | Trapezoidal |
Primary Application | Edge grinding and chamfering |
Work Material | Stone, ceramic tile, concrete |
Equipment Type | Stone/ceramic edge grinding lines |
Customization | Grit, hardness, dimensions, and profile available on request |
Model Code Breakdown
Code Segment | Meaning |
C/GC | Black / green silicon carbide abrasive blend |
54 | Grit size F54 |
H | Hardness grade H (medium-soft) |
7 | Structure number 7 (open) |
B | Resinoid bond |
YX | Manufacturer profile/application designation |
Application Guidelines
Recommended Operating Conditions
Parameter | Recommendation |
Mounting | Verify segment seat alignment and clamping torque; trapezoidal profile must seat flush against grinding head |
Speed | Operate within the resinoid bond’s rated peripheral speed; resin bonds are heat-sensitive |
Cooling | Wet grinding recommended for dust suppression and edge quality; if dry, use dust extraction |
Break-in | Brief light-load run-in helps seat the segment and expose fresh grain |
Dressing | If glazing occurs, a light dress restores cutting action; monitor spindle load as an indicator |
Suitable Materials
Granite, marble, and engineered stone edges
Porcelain and ceramic tile chamfering
Concrete edge finishing and profiling
Compatibility Note
This segment is a custom-manufactured item. Customers should confirm machine spindle interface, mounting dimensions, and operating speed range before ordering. Custom grit, hardness, and profile modifications are available to suit specific production line requirements.
Customization & OEM Capability
As a custom product, the C/GC54H7BYX can be adapted to meet specific customer requirements:
Customization Option | Available Range |
Grit size | Coarser or finer grades on request |
Hardness | Softer or harder resin bond formulations |
Dimensions | Adjusted to match existing mounting geometry |
Profile | Modified trapezoidal or alternative edge profiles |
Packaging | Private labeling and custom carton configurations |
Ordering Information
MOQ: Contact for minimum order quantity
Lead Time: Confirmed at order placement
Sample Policy: Evaluation samples available for qualified buyers
Documentation: Product specification sheets and material safety documentation provided upon request
FAQ
Q: What materials is this segment designed for?
A: The C/GC blend is formulated for stone, ceramic tile, and concrete edge grinding. Black SiC provides cutting efficiency on hard, brittle materials, while green SiC contributes to cooler cutting and finish consistency.
Q: Is this a standard stock item?
A: This is a custom-manufactured segment. Specifications can be tailored to your machine and production requirements. Contact us with your application details for a recommendation.
Q: Can you modify the dimensions or profile?
A: Yes. The 100 × 64/57 × 25 mm dimensions and trapezoidal profile can be adjusted to fit existing mounting arrangements. Provide a drawing or sample for reference.
Q: What is the recommended operating speed?
A: Operating speed depends on the specific resin bond formulation and machine setup. Confirm the rated peripheral speed with our technical team before operation.
Q: Do you offer samples for testing?
A: Evaluation samples are available for qualified buyers. Contact us with your application details and machine specifications.
Q: What is the lead time for custom orders?
A: Lead time varies based on specification complexity and order quantity. Confirmed at the time of order placement.
Resin Bonded Silicon Carbide Segment C/GC54H7BYX 了解批量采购及 OEM 订单的价格、交期和包装。